OSNews

Intel and others plan to release a new version of the ubiquitous Universal Serial Bus technology in the first half of 2008, a revamp the chip maker said will make data transfer rates more than 10 times as fast by adding fiber-optic links alongside the traditional copper wires. Intel is working with fellow USB 3.0 Promoters Group members Microsoft, Hewlett-Packard, Texas Instruments, NEC and NXP Semiconductors to release the USB 3.0 specification in the first half of 2008, said Pat Gelsinger, general manager of Intel's Digital Enterprise Group, in a speech here at the Intel Developer Forum.